Universal Global Standard ESD IC Component Matrix Trays Comply With JEDEC Standards

Product Description:

JEDEC IC matrix trays embody the common language of automation, a set of rigorous specifications established by the microelectronics industry to govern the secure and automated flow of integrated circuits, connectors, and assemblies. The fundamental principle of these trays is standardization: all are manufactured to the identical 12.7 x 5.35 inches (322.6 x 136mm) outline. This dimensional uniformity ensures that equipment built anywhere in the world can instantly recognize and interact with any JEDEC tray, regardless of the component it holds. The "matrix" structure, comprising rows and columns of component pockets, defines the exact spatial coordinates (pitch) for automated pick-up, transforming a collection of parts into a machine-readable data set. Constructed from robust molding compounds, often ESD-safe polymers utilizing carbon for conductivity (resulting in the default black color), JEDEC trays are designed to be strong and dimensionally stable. This stability is crucial not only for mechanical protection but also for maintaining precision alignment under both handling stress and specified thermal conditions, a necessity for reliable high-speed automation.

Features & Benefits:

The intelligent design features of JEDEC trays translate directly into tangible manufacturing efficiencies and convenience.

1. Standardized Outline (Instant Access): The most significant advantage is the Industry Standard status, which provides manufacturers with instant access to a global ecosystem of equipment, accessories, and industry knowledge. This vastly simplifies supply chain management and process integration.

2. Visual and Mechanical Alignment: Key features ensure process reliability. The 45-degree chamfer acts as a clear, visual Pin One indicator, reducing the risk of component misorientation during manual or automated loading. The scalloped feature allows for mechanical keying/fixation, ensuring the tray's position is locked into the feeder equipment for accurate pick-and-place operation.

3. Versatile Profile Options: Manufacturers can select the appropriate tray thickness: the Low Profile (0.25-inch) variant is the workhorse, accommodating common packages like SOIC and TQFP, optimizing vertical storage density. The High Profile (0.40-inch) option is available for larger or taller components such as modules, assemblies, and CERQUAD packages, ensuring proper clearance and protection for high components.

4. Enhanced Stackability: Trays incorporate robust interlocking features that ensure stack stability, crucial for safe storage and transport, even when stacked several trays high. The stacking arrangement is designed so that an empty tray serves as a protective cover for the components in the top loaded tray.

Technical Parameters:

Applications:

Customization:

The flexibility to design the internal matrix while rigidly adhering to the external JEDEC envelope is its most powerful feature.
Package-Specific Protection: Custom designs address the unique vulnerabilities of different component types. 
Material and Temperature Compatibility: Customization often revolves around material selection to achieve specific temperature compatibility and chemical resistance. 
Color and Capacity: While black is standard for ESD conductivity, custom colors can be used for visual process segregation. The internal capacity is optimized through custom design based on the component's geometry and any required special tray features, ensuring universal compatibility with JEDEC feeders.