logo
produtos
Casa / produtos / Bandejas de JEDEC IC /

Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design

Deep Pocket JEDEC Tray for Large IC Modules with Reusable Design

Nome da marca: Hiner-pack
Número do modelo: HN24225
MOQ: 500 unidades
preço: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Condições de pagamento: T/T
Capacidade de abastecimento: 2.000 unidades/dia
Informações pormenorizadas
Lugar de origem:
China
Certificação:
ROHS, ISO
Tray Weight:
Varia, normalmente até 500 gramas por cavidade
Cor:
Geralmente preto ou cinza escuro para proteção ESD
Garantia de Qualidade:
Garantia de entrega, qualidade fiável
Tamanho da cavidade:
48,5x45,5mm
Incoterms:
Exw, FOB, CIF, DDU, DDP
Tipo de molde:
Injeção
Reutilizável:
Sim
Forma da bandeja:
Retangular
Classe limpa:
Limpeza geral e ultrassônica
Tipo de IC:
BGA,QFP,QFN,LGA,PGA
Nível de embalagem:
Pacote de Transporte
Planicidade:
Menos de 0,76 mm
Capacidade:
2x5 = 10 peças
Detalhes da embalagem:
caixa, palete
Habilidade da fonte:
2.000 unidades/dia
Destacar:

Deep Pocket JEDEC IC tray

,

Large IC module storage tray

,

JEDEC standard IC holder

Descrição do produto
Deep Pocket JEDEC Tray for Large IC Modules
Ideal for large or thick semiconductor devices, ensuring secure placement.
Key Features/ Benefits 
  • Deep cavity for large components
  • Strong structural support
  • Prevents damage during transport
  • Custom pocket design
Specifications
Brand Hiner-pack
Model  HN24225
Material  PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×10.6 mm
Cavity Size 48.5x45.5 mm
Matrix QTY 2x5=10 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • Power modules
  • Industrial IC
  • Large semiconductor devices
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Automotive project experience
  • In-house mold design capability
  • Fast prototype development
  • Strict material control
  • Stable supply for global semiconductor customers