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High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

High Storage Efficiency Lightweight JEDEC Tray with ESD Protection for IC Packaging

Nome da marca: Hiner-pack
Número do modelo: HN24230
MOQ: 500 unidades
preço: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Condições de pagamento: T/T
Capacidade de abastecimento: 2.000 unidades/dia
Informações pormenorizadas
Lugar de origem:
China
Certificação:
ROHS, ISO
Tray Weight:
Varia, normalmente até 500 gramas por cavidade
Cor:
Geralmente preto ou cinza escuro para proteção ESD
Garantia de Qualidade:
Garantia de entrega, qualidade fiável
Tamanho da cavidade:
11x16,3x2,47mm
Incoterms:
Exw, FOB, CIF, DDU, DDP
Tipo de molde:
Injeção
Reutilizável:
Sim
Forma da bandeja:
Retangular
Classe limpa:
Limpeza geral e ultrassônica
Tipo de IC:
BGA,QFP,QFN,LGA,PGA
Nível de embalagem:
Pacote de Transporte
Planicidade:
Menos de 0,76 mm
Capacidade:
6x18 = 108 peças
Detalhes da embalagem:
caixa, palete
Habilidade da fonte:
2.000 unidades/dia
Destacar:

JEDEC IC tray for packaging

,

thin JEDEC IC tray

,

IC packaging tray with warranty

Descrição do produto
Thin JEDEC Tray for IC Packaging 
Designed for high-level semiconductor cleanroom environments, this tray minimizes contamination and ensures IC integrity.
Key Features/ Benefits 
  • Lower cost solution
  • Lightweight design
  • High storage efficiency
  • Easy handling
Specifications
Brand Hiner-pack
Model  HN24230
Material  MPPO
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×7.62 mm
Cavity Size 11x16.3x2.47 mm
Matrix QTY 6x18=108 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • Consumer IC
  • Standard packaging
  • Semiconductor fabs
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers