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JEDEC IC trays protect wafers for clean production

Nome da marca:	Hiner-pack
Número do modelo:	HN25020
MOQ:	500 unidades
preço:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Condições de pagamento:	T/T
Capacidade de abastecimento:	2.000 unidades/dia

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem:

China

Certificação:

ROHS, ISO

Tray Weight:

Varia, normalmente até 500 gramas por cavidade

Cor:

Preto

Garantia de Qualidade:

Garantia de entrega, qualidade fiável

Tamanho da cavidade:

322,6×135,9×7,62 milímetros

Incoterms:

Exw, FOB, CIF, DDU, DDP

Tipo de molde:

Injeção

Reutilizável:

Sim

Forma da bandeja:

Retangular

Classe limpa:

Limpeza geral e ultrassônica

Tipo de IC:

BGA,QFP,QFN,LGA,PGA

Nível de embalagem:

Pacote de Transporte

Planicidade:

Menos de 0,76 mm

Capacidade:

2x6 = 12 peças

Detalhes da embalagem:

caixa, palete

Habilidade da fonte:

2.000 unidades/dia

Descrição do produto

JEDEC IC trays protect wafers for clean production.

JEDEC IC Tray is manufactured with MPPO material. It provides reliable protection for wafers against contamination and impact during production, handling and transfer. The tray complies with standard JEDEC specifications and helps maintain a clean production environment for semiconductor applications.

It is widely used in semiconductor packaging, testing, storage and transportation. It performs well in cleanroom conditions and works smoothly with automated production equipment to ensure wafer integrity.

Customization is a core service. We support tailored sizes, structures and designs to meet diverse production requirements and improve overall production efficiency.

Key Features/ Benefits

Strong durable structure
Effective dust prevention
Safeguard wafer packaging processes
Clean production support
Flexible customization

Specifications

Brand		Hiner-pack
Model		HN25020
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6×135.9×7.62 mm
Cavity Size		48×45×2.75 mm
Matrix QTY		2X6=12 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Widely used in wafer packaging, die sorting, semiconductor assembly and cleanroom processing. Perfect for high-precision production lines in semiconductor packaging and integrated circuit manufacturing.

Also applied in inter-plant wafer transportation, finished chip storage and logistics shipping. Serve IC packaging factories, semiconductor manufacturers and electronic component logistics providers.

Customized Services

Provide professional customization for JEDEC IC trays according to wafer size and production needs. Customize cavity shape, depth and arrangement to ensure perfect fit.

Select high-performance materials for anti-static, high temperature or cleanroom use. Support prototype verification and mass production. Offer full custom solutions for packaging and transportation.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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