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High Precision Waffle Pack Trays deliver cleanroom contamination control and safe IC storage

High Precision Waffle Pack Trays deliver cleanroom contamination control and safe IC storage

Nome da marca: Hiner-pack
Número do modelo: HN24164
MOQ: 500 unidades
preço: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Condições de pagamento: T/T
Capacidade de abastecimento: 2.000 unidades/dia
Informações pormenorizadas
Lugar de origem:
China
Certificação:
ROHS, ISO
Cor:
Geralmente preto
Garantia de Qualidade:
Garantia de entrega, qualidade fiável
Incoterms:
Exw, FOB, CIF, DDU, DDP
Tipo de molde:
Injeção
Reutilizável:
Sim
Forma da bandeja:
Retangular
Classe limpa:
Limpeza geral e ultrassônica
Tipo de IC:
BGA,QFP,QFN,LGA,PGA
Nível de embalagem:
Pacote de Transporte
Deformação:
Deformação MÁX. 0,24 mm
Capacidade:
10x20=200 PCS
Detalhes da embalagem:
caixa, palete
Habilidade da fonte:
2.000 unidades/dia
Descrição do produto
Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

High precision cleanroom waffle pack trays fit strict semiconductor cleanroom production standards. Delivers powerful particulate contamination isolation performance for ultra-fine pitch fragile IC components. Do you need professional precision holders to guard valuable chips from pollution damage during manufacturing?


Features standardized JEDEC elongated grid cavity structure. Resists scratches, static interference and dust invasion effectively. Maintains stable clean performance across chip handling, transfer and daily storage procedures.


Owns durable stackable precision loading design. Fully adapts semiconductor packaging, testing, logistics transportation and inventory demands. Preserves complete clean intact status of high-value sensitive IC chips in whole industrial chains.

Key Features/ Benefits 
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Adopts high-precision elongated JEDEC grid structure
  • Protects ultra-delicate fine pitch ESD-sensitive IC chips
Specifications
Brand Hiner-pack
Model HN24164
Color Usually black 
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×7.4 mm
Matrix QTY 10x20=200 PCS
Cavity Size  3.00X0.7X0.22
Warpage MAX 0.24mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Cleanroom-grade waffle pack IC trays cover full semiconductor workflows, including manufacturing, packaging, inspection, testing, transportation and storage.


With top contamination control performance, trays protect ESD-sensitive fine pitch chips well. Trays adapt to QFN/BGA/CSP packaging, automated pick-and-place lines, semiconductor testing operations and daily IC logistics inventory management.

Customized Services
Waffle pack IC trays support fully customized cavity grid layouts and slot sizes. Custom designs match diverse fine pitch IC chip specifications. Customized dimension, material and JEDEC standard structures meet exclusive cleanroom production and handling demands for different semiconductor application scenarios.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers