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Durable Dense Cavity Waffle Pack IC Handling Trays

Nome da marca:	Hiner-pack
Número do modelo:	HN24168
MOQ:	500 unidades
preço:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Condições de pagamento:	T/T
Capacidade de abastecimento:	2.000 unidades/dia

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem:

China

Certificação:

ROHS, ISO

Tray Weight:

Varia, normalmente até 500 gramas por cavidade

Cor:

Preto

Garantia de Qualidade:

Garantia de entrega, qualidade fiável

Tamanho da linha de contorno:

50,8×50,8×6,2mm

Tamanho da cavidade:

1,35x1,30x1,0mm

Incoterms:

Exw, FOB, CIF, DDU, DDP

Tipo de molde:

Injeção

Reutilizável:

Sim

Forma da bandeja:

Retangular

Classe limpa:

Limpeza geral e ultrassônica

Tipo de IC:

BGA,QFP,QFN,LGA,PGA

Nível de embalagem:

Pacote de Transporte

Deformação:

Deformação MÁX. 0,26 mm

Capacidade:

10x10 = 100 unidades

Detalhes da embalagem:

caixa, palete

Habilidade da fonte:

2.000 unidades/dia

Descrição do produto

Durable Dense Cavity Waffle Pack IC Handling Trays

Dense cavity JEDEC waffle pack trays meet strict international semiconductor cleanroom standards. Delivers stable particulate contamination isolation and professional ESD anti-static performance, fully protecting fragile fine pitch integrated circuit components from production damage.

Features uniform precise dense square cavity grid structure. Owns durable interlocking stackable design, effectively resists dust pollution, scratch damage and electrostatic interference through all chip handling and transfer procedures.

Covers full semiconductor packaging, inspection, testing, logistics transportation and inventory storage scenarios. Maintains long-term clean and stable status for sensitive high-value IC chips. Supports fully customized pocket cavity specifications for diversified chip models.

Key Features/ Benefits

Anti-static & dust-proof design for safe chip handling
Offers stable cleanroom-grade contamination control
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24168
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×6.2 mm
Cavity Size		1.35x1.30x1.0 mm
Matrix QTY		10x10=100 PCS
Warpage		MAX 0.26mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Cleanroom-grade Waffle Pack IC Trays provide full protection for semiconductor chips with contamination control & ESD anti-static performance.

Fine pitch IC packaging (QFN, BGA, CSP bare die)
JEDEC compatible automated pick-and-place lines
Semiconductor inspection & testing processes
Cleanroom IC logistics transportation & storage management

Packaging & Shipping/ Services

Our high-precision JEDEC trays are packaged in durable, ESD-safe anti-static materials with secure interlocking stacking design and shock-absorbing cushioning inserts, ensuring maximum protection against physical damage, electrostatic discharge, and contamination during transit and storage.

All shipments are fully tracked and handled by trusted global logistics carriers, ensuring reliable, on-time worldwide delivery to your facility. We provide flexible shipping options to meet your urgent production needs, including expedited shipping for rush orders, and comprehensive shipping documentation to streamline customs clearance for international orders.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

Bandejas de JEDEC IC

Bandejas da matriz de JEDEC

IC Chip Tray

Bandejas feitas sob encomenda de JEDEC

Bloco Chip Trays do waffle

Bandeja dos componentes eletrônicos

Desencapado morrem as bandejas

Anti bandejas estáticas

Grampos das tampas do bloco do waffle

Caixa pegajosa do gel

Caixa de transporte da bolacha

Caixa de Wafer Metálico

Bandejas de JEDEC IC

Bandejas da matriz de JEDEC

IC Chip Tray

Bandejas feitas sob encomenda de JEDEC

Bloco Chip Trays do waffle

Bandeja dos componentes eletrônicos

Desencapado morrem as bandejas

Anti bandejas estáticas

Grampos das tampas do bloco do waffle

Caixa pegajosa do gel

Caixa de transporte da bolacha

Caixa de Wafer Metálico

Durable Dense Cavity Waffle Pack IC Handling Trays

Durable Dense Cavity Waffle Pack IC Handling Trays

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