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Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

Nome da marca:	Hiner-pack
Número do modelo:	HN24190
MOQ:	500 unidades
preço:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Condições de pagamento:	T/T
Capacidade de abastecimento:	2.000 unidades/dia

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem:

China

Certificação:

ROHS, ISO

Tray Weight:

Varia, normalmente até 500 gramas por cavidade

Cor:

Preto

Garantia de Qualidade:

Garantia de entrega, qualidade fiável

Tamanho da linha de contorno:

50,8×50,8×4mm

Tamanho da cavidade:

2,2x1,35x0,53mm

Incoterms:

Exw, FOB, CIF, DDU, DDP

Tipo de molde:

Injeção

Reutilizável:

Sim

Forma da bandeja:

Retangular

Classe limpa:

Limpeza geral e ultrassônica

Tipo de IC:

BGA,QFP,QFN,LGA,PGA

Nível de embalagem:

Pacote de Transporte

Deformação:

Deformação MÁX. 0,23 mm

Capacidade:

10x9=90 PCS

Detalhes da embalagem:

caixa, palete

Habilidade da fonte:

2.000 unidades/dia

Destacar:

Anti-Static Waffle Pack Chip Trays

Reusable Semiconductor IC Trays

Customizable Cavity Size IC Chip Trays

Descrição do produto

ESD Anti Static Semiconductor Waffle Chip Trays

Deliver precise waffle structure to cradle delicate IC chips tightly, eliminating movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.

Integrate seamlessly with automated packaging lines and cleanroom workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.

Support full customization of cavity size, spacing, and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.

Key Features/ Benefits

Deliver effective ESD anti-static performance
Anti-static protection
Suitable for Delicate Fine Pitch ICs
Secure chip holding
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24190
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×4 mm
Cavity Size		2.2x1.35x0.53 mm
Matrix QTY		10x9=90 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Support semiconductor wafer dicing, die sorting, device testing, and precision component kitting operations. Work seamlessly with automated pick-and-place systems, ESD-controlled production lines, and clean manufacturing environments

Also applied in inter-plant component transfer, international shipping of sensitive chips, and long-term inventory storage. Serve semiconductor fabs, IC packaging facilities, and global electronic component distributors.

Packaging & Shipping/ Services

Provide fully customized solutions for anti-static waffle pack trays. Adjust cavity size, spacing, and layout to fit diverse chip dimensions.

Leverage durable anti-static material for enhanced protection. Offer prototype testing and personalized design support to meet unique production and packaging needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

Bandejas de JEDEC IC

Bandejas da matriz de JEDEC

IC Chip Tray

Bandejas feitas sob encomenda de JEDEC

Bloco Chip Trays do waffle

Bandeja dos componentes eletrônicos

Desencapado morrem as bandejas

Anti bandejas estáticas

Grampos das tampas do bloco do waffle

Caixa pegajosa do gel

Caixa de transporte da bolacha

Caixa de Wafer Metálico

Bandejas de JEDEC IC

Bandejas da matriz de JEDEC

IC Chip Tray

Bandejas feitas sob encomenda de JEDEC

Bloco Chip Trays do waffle

Bandeja dos componentes eletrônicos

Desencapado morrem as bandejas

Anti bandejas estáticas

Grampos das tampas do bloco do waffle

Caixa pegajosa do gel

Caixa de transporte da bolacha

Caixa de Wafer Metálico

Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

Anti-Static Reusable Waffle Pack Chip Trays with Customizable Cavity Size for Semiconductor ICs

Anti-Static Waffle Pack Chip Trays

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Customizable Cavity Size IC Chip Trays

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