produtos

Casa / produtos / Bloco Chip Trays do waffle /

Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

Nome da marca:	Hiner-pack
Número do modelo:	HN24198
MOQ:	500 unidades
preço:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Condições de pagamento:	T/T
Capacidade de abastecimento:	2.000 unidades/dia

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem:

China

Certificação:

ROHS, ISO

Tray Weight:

Varia, normalmente até 500 gramas por cavidade

Cor:

Preto

Garantia de Qualidade:

Garantia de entrega, qualidade fiável

Tamanho da linha de contorno:

50,7×50,7×4mm

Tamanho da cavidade:

1,8x1,8x1,27mm

Incoterms:

Exw, FOB, CIF, DDU, DDP

Tipo de molde:

Injeção

Reutilizável:

Sim

Forma da bandeja:

Retangular

Classe limpa:

Limpeza geral e ultrassônica

Tipo de IC:

BGA,QFP,QFN,LGA,PGA

Nível de embalagem:

Pacote de Transporte

Deformação:

Deformação MÁX. 0,26 mm

Capacidade:

16x16=256 PCS

Detalhes da embalagem:

caixa, palete

Habilidade da fonte:

2.000 unidades/dia

Descrição do produto

Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

Deliver precise grid-style waffle structure to securely hold fine pitch ICs, preventing component shifting and electrostatic damage during handling. Made of durable anti-static material to maintain stable performance in industrial settings, offering reliable protection for sensitive semiconductor devices.

Integrate smoothly with automated pick-and-place systems and clean manufacturing workflows, performing reliably in chip loading, transfer, and sorting procedures. Adapt flexibly to high-precision semiconductor production scenarios, boosting operational efficiency and component integrity.

Support full customization of cavity size, pitch, and layout to match unique fine pitch IC dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard delicate components throughout transit and long-term storage.

Key Features/ Benefits

Durable anti-static material
Offers stable cleanroom-grade contamination control
Stable component holding
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
Precise waffle structure.

Specifications

Brand		Hiner-pack
Model		HN24198
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4 mm
Cavity Size		1.8x1.8x1.27 mm
Matrix QTY		16x16=256 PCS
Warpage		MAX 0.26mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Support advanced semiconductor packaging, fine pitch die sorting, device testing, and precision component kitting operations. Pair seamlessly with automated pick-and-place systems, ESD-controlled production lines, and clean manufacturing environments.

Also used for inter-plant component transfer, international shipping of sensitive fine pitch devices, and long-term inventory storage. Serve semiconductor fabs, advanced packaging facilities, and high-tech electronic component distributors.

Packaging & Shipping/ Services

Come in standard anti-static packaging to ensure product integrity during transit. Each tray is wrapped in protective film and placed in rigid cartons to prevent deformation and scratches.

Support bulk shipping via sea, air or express, with secure stacking to avoid damage during long-distance transportation. Ensure products arrive in good condition for immediate use in production.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

Bandejas de JEDEC IC

Bandejas da matriz de JEDEC

IC Chip Tray

Bandejas feitas sob encomenda de JEDEC

Bloco Chip Trays do waffle

Bandeja dos componentes eletrônicos

Desencapado morrem as bandejas

Anti bandejas estáticas

Grampos das tampas do bloco do waffle

Caixa pegajosa do gel

Caixa de transporte da bolacha

Caixa de Wafer Metálico

Bandejas de JEDEC IC

Bandejas da matriz de JEDEC

IC Chip Tray

Bandejas feitas sob encomenda de JEDEC

Bloco Chip Trays do waffle

Bandeja dos componentes eletrônicos

Desencapado morrem as bandejas

Anti bandejas estáticas

Grampos das tampas do bloco do waffle

Caixa pegajosa do gel

Caixa de transporte da bolacha

Caixa de Wafer Metálico

Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

Durable Anti-Static Waffle Pack Trays for Fine Pitch ICs

Bandejas do bloco do waffle do ABS

Bloco Chip Trays do waffle do ABS

Bloco Chip Trays do waffle

ABS Padrão Waffle Pack Trays de chips Resistência a altas temperaturas para pequenos componentes

O bloco reusável personalizado Chip Trays MPPO do waffle para a bolacha morre

ABS MPPO Waffle Pack Bare Die Tray 36 PCS Embalagem do dispositivo óptico

Microplaquetas coloridas pretas customizáveis de Chip Trays For IC RF VR do bloco do waffle do ESD