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Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

Name: Durable Grid Waffle Trays for Safe Fine Pitch IC Handling
Brand: Shenzhen Hiner Technology Co., Ltd.
SKU: HN24200
Price: 1.35 USD
Availability: InStock

Nome da marca:	Hiner-pack
Número do modelo:	HN24200
MOQ:	500 unidades
preço:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Condições de pagamento:	T/T
Capacidade de abastecimento:	2.000 unidades/dia

Informações pormenorizadas

Descrição do produto

Informações pormenorizadas

Lugar de origem:

China

Certificação:

ROHS, ISO

Tray Weight:

Varia, normalmente até 500 gramas por cavidade

Cor:

Preto

Garantia de Qualidade:

Garantia de entrega, qualidade fiável

Tamanho da linha de contorno:

50,8×50,8×3,94mm

Tamanho da cavidade:

6,7X4,0X1,07mm

Incoterms:

Exw, FOB, CIF, DDU, DDP

Tipo de molde:

Injeção

Reutilizável:

Sim

Forma da bandeja:

Retangular

Classe limpa:

Limpeza geral e ultrassônica

Tipo de IC:

BGA,QFP,QFN,LGA,PGA

Nível de embalagem:

Pacote de Transporte

Deformação:

Deformação MÁX. 0,26 mm

Capacidade:

5x7 = 35 peças

Detalhes da embalagem:

caixa, palete

Habilidade da fonte:

2.000 unidades/dia

Descrição do produto

Durable Grid Waffle Trays for Safe Fine Pitch IC Handling

Feature uniform grid design to hold fine pitch ICs steadily without shifting. Fit various industrial processes and protect sensitive components from damage during daily operation.

Bring reliable performance for long-term use and reduce component loss in production and transfer. Match automatic equipment to improve working efficiency effectively.

Accept customized cavity size and layout to meet different chip requirements. Focus on practical protection to satisfy diverse production demands.

Key Features/ Benefits

Secure component fixing
Offers stable cleanroom-grade contamination control
Stable component holding
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
Precise waffle structure.

Specifications

Brand		Hiner-pack
Model		HN24200
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×3.94 mm
Cavity Size		6.7X4.0X1.07 mm
Matrix QTY		5x7=35 PCS
Warpage		MAX 0.26mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suitable for fine pitch IC storage, production line transfer, component testing and packaging. Work stably in automatic industrial systems and daily manufacturing processes.

Applied in semiconductor factories, electronic assembly plants and chip packaging workshops. Ideal for industrial production, internal transportation and long-term component storage.

Packaging & Shipping/ Services

Packed in standard cartons with protective inner layers to avoid scratches and deformation. Support safe stacking for bulk transportation.

Available for sea, air and international express shipping. Ensure products arrive in good condition and ready for immediate industrial use.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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Contato rápido

Endereço

Edifício A11, Zona D, Zona Industrial Oeste, Comunidade Minzhu, Rua Shajing, Distrito de Baoan, Cidade de Shenzhen, Província de GD, CN

Telefone

+1-(408)-669-7847

E-mail

Rainbowzhu@hiner-pack.com

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